Structure of Sulfonium, [4-[1-(difluorosulfomethyl)-2,2,2-trifluoroethoxy]phenyl]bis[4-(1,1-dimethylethyl)phenyl]-, inner salt CAS 1465790-38-8

Sulfonium, [4-[1-(difluorosulfomethyl)-2,2,2-trifluoroethoxy]phenyl]bis[4-(1,1-dimethylethyl)phenyl]-, inner salt CAS 1465790-38-8

Identification

CAS Number

1465790-38-8

Name

Sulfonium, [4-[1-(difluorosulfomethyl)-2,2,2-trifluoroethoxy]phenyl]bis[4-(1,1-dimethylethyl)phenyl]-, inner salt

Synonyms

2-(4-(bis(4-(tert-butyl)phenyl)sulfonio)phenoxy)-1,1,3,3,3-pentafluoropropane-1-sulfonate;PAG388

SMILES

StdInChI

StdInChIKey

Molecular Formula

C29H31F5O4S2

Molecular Weight

602.68

Properties

Appearance

White to off-white powder

Safety Data

RIDADR 

NONH for all modes of transport

Specifications and Other Information of Our Sulfonium, [4-[1-(difluorosulfomethyl)-2,2,2-trifluoroethoxy]phenyl]bis[4-(1,1-dimethylethyl)phenyl]-, inner salt CAS 1465790-38-8

Identification Methods

HNMR, HPLC

Purity

99% min, 99.5% min

Total Heavy Metals Impurities

<100ppb,<50ppb

Shelf Life

2 years

Storage

Under room temperature away from light

Known Application

I. Core Function: Photoacid Generator (PAG)
This compound is an aryl-triaryl sulfonium inner salt and serves as a cationic photoacid generator (PAG). Under UV or deep-UV (DUV) irradiation:
It absorbs light and undergoes photolytic cleavage
Produces a strong acid (e.g., difluoromethanesulfonic acid)
The generated acid can catalyze chemically amplified reactions or initiate subsequent cationic polymerization. It is a key functional additive in photoresist and photopolymer curing systems.
II. Main Application Areas

  1. Semiconductor Photoresists (Chemically Amplified Photoresists, CARs)
    Applicable to:
    i-line, KrF, and ArF lithography systems
    High-resolution chemically amplified photoresists
    Main functions:
    Acid generation upon exposure
    Catalyzes deprotection reactions
    Amplifies exposure effects → improves resolution, sensitivity, and critical dimension / line edge roughness (CD/LER) control
    Structural advantages:
    Difluoromethylsulfonyl and trifluoroethoxy groups → high acid strength, low diffusion
    Aromatic and tert-butyl groups → improve thermal stability and solubility
    Inner salt structure → reduces migration and enhances optical performance in photoresists
  2. Cationic Photocuring Systems
    Used in UV-induced cationic curing of epoxy resins and vinyl ether systems
    UV irradiation → acid generation → initiates cationic ring-opening polymerization or crosslinking
    Applications include:
    UV-curable coatings and inks
    Electronic encapsulation materials
    Photo-patternable insulating layers (e.g., PSPI, PI)

This product is developed by our R&D company Watson International Ltd (https://www.watson-int.com/).