Copper Phosphide (Cu3P)

Name

Copper Phosphide

Molecular Formula

Cu3P

Molecular Weight

CAS Number (Or Watson Number for Non-CAS Products)

12019-57-7

Appearance

Gray-black powder

Density

5.8g/cm³

Melting Point

979℃

Boiling Point

Other Information

Purity

4N (99.99%), 5N (99.999%)

Quality Analysis

ICP-MS(99.999% all impurities is below 10ppm), XRD(the main peak is perfectly symmetric )

Package

It is vacuum packed in bottle protected by inert gas.

Applications

The chip diffusion source is used in the semiconductor manufacturing process to introduce specific impurities (dopants) onto the surface of the chip to alter the electrical properties of the material. The diffusion source can be in the form of solid, liquid, or gas and is commonly used in processes such as doping diffusion and ion implantation.

Links

This product is exclusively authorized for distribution and sale through Watson International, and please click the link below for details. (https://www.watson-int.com/), and here is the corresponding link https://www.watson-int.com/Copper-Phosphide-Cu3P-12019-57-7/